The
Thin Profile Fine Pitch Ball
Grid Array,
or TFBGA,
is
a
thinner version of the
FBGA package. Like all BGA packages, TFBGA's use solder balls that are
arranged in a grid or
array at the bottom of the package body for external electrical
connection. The TFBGA is near-chip-scale in size
and features ball pitch values that are
even tighter than those of the FBGA.
Typical TFBGA's have ball counts that range
from 16 to 384 solder balls. The typical TFBGA ball pitch is
0.5 mm to 0.8 mm.
The typical
TFBGA package thickness is greater than 1 mm
but not more than 1.2 mm.
Table 1.
Properties of Some TFBGA's
|
No. of
Balls |
Body
Size |
Package Height
(incl.
solder balls) |
Ball Pitch |
|
16 |
3 mm x 3
mm |
1.2 mm |
0.5 mm |
|
48 |
7 mm x 7
mm |
1.2 mm |
0.75 mm |
|
64 |
7 mm x 7
mm |
1.1 mm |
0.5 mm |
|
72 |
5 mm x 5
mm |
1.2 mm |
0.5 mm |
|
121 |
6 mm x 6
mm |
1.2 mm |
0.5 mm |
|
152 |
14 mm x 14
mm |
1.1 mm |
0.65 mm |
|
196 |
8 mm x 8
mm |
1.2 mm |
0.5 mm |
|
324 |
15 mm x 15
mm |
1.2 mm |
0.8 mm |
