Ion Beam (FIB) techniques are used in a variety of applications.
In terms of failure analysis, FIB techniques are commonly used in
microscopy, die surface
FIB system works very similarly to a scanning electron microscope,
except that it uses a
finely focused beam of gallium (Ga+)
of the latter's use of electrons.
This focused primary beam of gallium ions is rastered on the
surface of the material to be analyzed.
As it hits the surface, a small amount of material is
or dislodged, from the surface.
Focused Ion Beam (FIB) Stations
dislodged material may be in the form of secondary ions,
ions, atoms, and electrons are then collected and analyzed as signals to
form an image on a screen as the primary beams scans the surface.
This image forming capability allows high magnification
higher the primary beam current, the more material is sputtered from the
surface. If only high-mag
is intended, only a
low-beam operation must be employed.
High-beam operation is used to sputter or remove material from
the surface, such as during high-precision milling or cross-sectioning
of an area on the die.
of a DRAM cell produced by FIB
FIB system can also bombard an area on the die with various
gases as it
performs primary beam sputtering. Depending on the gases used, these gases can react with the
primary beam to either
material from or
material onto the surface.
SEM/TEM; FA Lab
Equipment; Basic FA
Package Failures; Die
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