Semiconductor Manufacturing FAQ's



Below are some frequently asked questions about semiconductor manufacturing.  




What failure mechanisms can arise from the presence of internal package delamination?




What does the Cpk number for an electrical test parameter stand for?

What are electrical test guard bands and what are they for?




What failure mechanisms are bake-recoverable?

How can one distinguish an EOS damage from an ESD damage?

How can one determine the root cause of an ESD issue?

How should intermittent failures be analyzed?

What is the purpose of preconditioning or SHRT before reliability testing?

Can a reliability test induce false failures?

What is the equivalent life in the field of a Temperature Cycle Test (TCT)?







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