Package-related Failure Mechanisms and Attributes (Page 2)

Package-related Failure Mechanisms and Attributes (Page 2 of 3)

<Back to Page 1> <Proceed to Page 3>

Heel Breaks

Heel Breaking is the severing of the wire from its wedge or crescent bond due to a fracture in the heel.

See separate article on heel breaks.

Lead/Leadframe Corrosion

Lead/Leadframe corrosion, as the name implies, refers to the corrosion of the lead or leadframe itself.

See separate article on lead/leadframe corrosion.

Lead Pulling

Lead pulling is the condition wherein the leads are yanked out of the package without breaking.

See separate article on lead pulling.

Lead Tearing

Lead tearing is the ripping apart of the lead somewhere along its length, usually at the bends.

See separate article on lead tearing.

Marking Failures

See separate article on marking failures.

Neck Breaks

Neck Breaking is the severing of the wire from its ball bond due to a fracture in the neck.

See separate article on neck breaks.

Package Cracking, Ceramic

Ceramic package cracking is the occurrence of fracture(s) anywhere in or on a ceramic package.

See separate article on ceramic package cracking.

Package Cracking, Plastic

Plastic package cracking is the occurrence of fracture(s) anywhere in or on a plastic package.

See separate article on plastic package cracking.

Package Delamination, Plastic

Plastic delamination refers to the disbonding between a surface of the plastic package and that of another material. Plastic delamination may therefore occur at an interface of the plastic and the leadframe, die, die paddle, or die attach material.

See separate article on plastic package delamination.

<Back to Page 1>

<Proceed to Page 3>

HOME