Semiconductor Photo Gallery



Die Surface Contamination


Figure 1. Die Surface Contamination


Figure 1 shows SEM photos of a microscopic heap of contaminant material on the surface of a die at low magnification (left) and high magnification (right).


EDX analysis needs to be performed on dice such as this to identify the elements present in the contamination. The presence of foreign elements such as Cl, S, and P can lead to corrosion, and must therefore be considered as a possible ground for rejecting all units that may be affected by the same contamination issue. 


See Also:  Internal Contamination; Die Corrosion


Back to Semiconductor Photo Gallery




Copyright 2006 All Rights Reserved.