The
Ceramic Ball
Grid Array,
or CBGA,
is
a square-shaped or rectangular ceramic package that uses solder balls for
external electrical connection instead of leads. These solder
balls are arranged in a grid or
array at the bottom of the ceramic package body, hence the name 'ceramic
ball grid array'.
Actually,
the
CBGA is just
one of several types of the BGA package.
Typical CBGA's have
ball counts that range from 9 to 324, although CBGA's with more balls do
exist. In fact, the new and smaller CBGA version known as the
μCBGA can come
with more than a thousand solder balls.
Ball pitch
(distance between
solder balls) values typically used by the CBGA package are 0.8 mm and 1.0 mm,
while a
μCBGA
commonly uses a ball pitch of
0.4 mm. Solder ball arrangement patterns used by the CBGA
can be one of these three: perimeter, staggered, or full grid
array. Typical CBGA body sizes range from 4 mm square to 35 mm square.
Table 1.
Properties of Some CBGA's
|
Package |
No. of
Balls |
Body
Size |
Body
Thickness |
Ball Pitch |
|
14-CBGA |
14 |
4.5 mm x
7.0
mm |
1.04 mm |
1.0 mm |
|
32-CBGA |
32 |
6.85 mm x
6.85
mm |
2.9 mm |
0.8 mm |
|
100-CBGA |
100 |
9 mm x 9
mm |
1.2 mm |
0.8 mm |
|
64-μCBGA |
64 |
4 mm x 4
mm |
1 mm |
0.4 mm |
|
132-μCBGA |
132 |
6 mm x 6
mm |
1 mm |
0.4 mm |
