IC Package Types


The semiconductor industry manufactures a very huge variety of integrated circuits that have different packaging requirements.  Package attributes that are taken into consideration when choosing a package type for a particular semiconductor device include: size, lead count, power dissipation, field operating conditions, and of course, cost.


Popular IC package types used in the semiconductor industry today are presented in Table 1 below.


Table 1.  Types of IC Packages (not shown in scale)

CBGA - Ceramic Ball Grid Array

CCGA - Ceramic Column Grid Array 

CerDIP - Ceramic Dual-in-Line Package 

CerPack - Ceramic Package 

CLCC - Ceramic Leadless Chip Carrier

CPGA - Ceramic Pin Grid Array

CQFP - Ceramic Quad Flat Pack

D2PAK or DDPAK - Dou-ble Decawatt Package

D3PAK - Decawatt Package 3

DFN - Dual Flat No Leads Package

DPAK - Decawatt Package

FBGA - Fine-Pitch Ball Grid Array

JLCC - J-Leaded Ceramic Chip Carrier 

LFBGA - Low Profile Fine-Pitch Ball Grid Array 

LGA - Land Grid Array 

LQFP - Low-Profile Quad Flat Package 

MLP - Micro Leadframe Package 

MQFP - Metric Quad Flat Package 

MSOP - Micro Small Outline Package 

PBGA - Plastic Ball Grid Array

PDIP - Plastic Dual-in-Line Package 

PLCC - Plastic Leaded Chip Carrier

PPGA - Plastic Pin Grid Array

PQFN - Power Quad Flat No Leads Package


PQFP - Plastic Quad Flat Pack

PSOP - Power Small Outline Package

QFN - Quad Flat No Leads Package

QSOP - Quarter Size Outline Package

SBDIP - Sidebraze Dual-in-Line Package

SC-70 - Small Outline Transistor

SIP - Single-In-Line Package

SOIC - Small Outline IC Package

SOJ - Small Outline J-Lead Package

SOT-23 - Small Outline Transistor

SPDIP - Shrink Plastic Dual-in-Line Package

SSOP - Shrink Small Outline Package

TDFN - Thin Dual Flat No Leads Package

TFBGA - Thin Fine-Pitch Ball Grid Array

TQFN - Thin Quad Flat No Leads Package

TQFP - Thin Quad Flat Pack

TSOP - Thin Small Outline Package

TSSOP - Thin Shrink Small Outline Package

UTDFN - Ultra Thin Dual Flat No Leads Package

UTQFN - Ultra Thin Quad Flat No Leads Package

VFBGA - Very Thin Fine-Pitch Ball Grid Array

VSOP - Very Small Outline Package

XDFN - Extreme Thin Dual Flat No Leads Package

XQFN - Extreme Thin Quad Flat No Leads Package


See also: 'Transistor Outline' or TO-Packages




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