The semiconductor industry manufactures a very huge variety of
integrated circuits that have different packaging requirements.
Package attributes that are taken into consideration when choosing a
package type for a particular semiconductor device include: size, lead
count, power dissipation, field operating conditions, and of course,
cost.
Popular IC package types used in the semiconductor industry today are
presented in
Table 1 below.
Table 1. Types of IC
Packages (not shown in scale)
![](pkg-cbga.jpg) |
CBGA
- Ceramic Ball Grid Array |
![](pkg-ccga.jpg) |
CCGA
- Ceramic Column Grid Array
|
![](pkg-cerdip.jpg) |
CerDIP
- Ceramic Dual-in-Line Package
|
![](pkg-cerpack.jpg) |
CerPack
- Ceramic Package |
![](pkg-clcc.jpg) |
CLCC
- Ceramic Leadless Chip Carrier |
![](pkg-cpga.jpg) |
CPGA - Ceramic
Pin Grid
Array |
![](pkg-cqfp.jpg) |
CQFP - Ceramic Quad Flat Pack |
![](pkg-ddpak.jpg) |
D2PAK or DDPAK
-
Dou-ble
Decawatt Package |
![](pkg-d3pak.jpg) |
D3PAK
-
Decawatt Package
3 |
![](pkg-dfn.jpg) |
DFN
-
Dual Flat No
Leads Package |
![](pkg-dpak.jpg) |
DPAK
-
Decawatt Package |
![](pkg-fbga.jpg) |
FBGA
-
Fine-Pitch
Ball Grid Array |
![](pkg-jlcc.jpg) |
JLCC
- J-Leaded Ceramic Chip Carrier
|
![](pkg-lfbga.jpg) |
LFBGA
- Low Profile Fine-Pitch Ball Grid Array
|
![](pkg-lga.jpg) |
LGA
- Land Grid Array
|
![](pkg-lqfp.jpg) |
LQFP
- Low-Profile Quad Flat Package
|
![](pkg-mlp.jpg) |
MLP
- Micro Leadframe Package
|
![](pkg-mqfp.jpg) |
MQFP
- Metric Quad Flat Package
|
![](pkg-msop.jpg) |
MSOP
- Micro Small Outline Package
|
![](pkg-pbga.jpg) |
PBGA - Plastic
Ball Grid
Array |
![](pkg-pdip.jpg) |
PDIP - Plastic Dual-in-Line Package
|
![](pkg-plcc.jpg) |
PLCC - Plastic Leaded Chip Carrier
|
![](pkg-ppga.jpg) |
PPGA - Plastic
Pin Grid
Array |
![](pkg-pqfn.jpg) |
PQFN - Power Quad Flat No Leads Package |
|
|
![](pkg-pqfp.jpg) |
PQFP - Plastic Quad Flat Pack |
![](pkg-psop.jpg) |
PSOP - Power Small Outline Package |
![](pkg-qfn.jpg) |
QFN -
Quad Flat No
Leads Package |
![](pkg-qsop.jpg) |
QSOP -
Quarter Size
Outline Package |
![](pkg-sidebraze.jpg) |
SBDIP - Sidebraze Dual-in-Line Package |
![](pkg-sc70.jpg) |
SC-70 - Small Outline Transistor |
![](pkg-sip.jpg) |
SIP - Single-In-Line Package |
![](pkg-soic.jpg) |
SOIC - Small Outline IC Package |
![](pkg-soj.jpg) |
SOJ - Small Outline J-Lead Package |
![](pkg-sot.jpg) |
SOT-23 - Small Outline Transistor |
![](pkg-spdip.jpg) |
SPDIP - Shrink Plastic Dual-in-Line Package
|
![](pkg-ssop.jpg) |
SSOP - Shrink Small Outline Package
|
![](pkg-tdfn.jpg) |
TDFN - Thin Dual Flat
No
Leads Package |
![](pkg-tfbga.jpg) |
TFBGA - Thin
Fine-Pitch Ball Grid Array |
![](pkg-tqfn.jpg) |
TQFN - Thin Quad Flat
No
Leads Package |
![](pkg-tqfp.jpg) |
TQFP - Thin Quad Flat Pack
|
![](pkg-tsop.jpg) |
TSOP - Thin Small Outline Package |
![](pkg-tssop.jpg) |
TSSOP - Thin Shrink Small Outline Package |
![](pkg-utdfn.jpg) |
UTDFN - Ultra Thin Dual Flat No Leads Package |
![](pkg-utqfn.jpg) |
UTQFN - Ultra Thin Quad Flat No Leads Package |
![](pkg-vfbga.jpg) |
VFBGA - Very Thin Fine-Pitch Ball
Grid Array |
![](pkg-vsop.jpg) |
VSOP - Very Small Outline Package |
![](pkg-xdfn.jpg) |
XDFN - Extreme Thin Dual Flat No Leads Package |
![](pkg-xqfn.jpg) |
XQFN - Extreme Thin Quad Flat No Leads Package |
|