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        TSOP Singulation / Test / Tape & Reel 
                       
        
        
        
        
        
                
        
        
              
		    
         
        
        
        
        
        
        
        
        
        
        
        
        Due to a wide 
		variety of IC packages used in the semiconductor industry, there also 
		exist a large variety of manufacturing processes for IC packaging.  
		Semiconductor companies do their best to standardize their processes to 
		make their operations more efficient and less costly.  
		Unfortunately, making an assembly process for a particular package 
		efficient may sometimes mean having to come up with a process that's 
		different from those of other packages. The continuous struggle between 
		the regular emergence of new and different packages versus the 
		standardization of packaging processes has always posed a challenge to 
		semiconductor manufacturing engineers.  The archived forum thread 
		below reflects this complex nature of semiconductor production 
		operations.  
		
          
        
		
			
				
				
					
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						Posted by 
						Mike_Balbuena: Fri Jun 23, 2006 10:48 pm   
						 Post subject: TSOP singulation Process  | 
					 
					
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						In the assembly side at 
						singulation process does the singulation equipment 
						dispense units in tube? Or this is already an automated 
						equipment that incorporates singulation-final test and 
						Tape and Reel. I'm just confused since the standard 
						dictates units to be in tray or reel. Is there a pick 
						and place and moves units to the cavity trays instead of 
						operator manually loading the units in the tray?
						Please help and clarify.  
						 
						Thanks, 
						Mike B.  | 
					 
				 
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						Posted by Jefriz: Thu 
						Jul 06, 2006 7:33 am    Post 
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						Mike,  
						
        
						
						
						 
						
      
        
        
        
        
        
        
        
        
        
        
        				
						Singulated TSOP units usually uses trays. Final test 
						handlers are mostly not incorporated or in-line with 
						singulation equipment. Can you tell what standard you 
						are referring? Singulation machines using trays are 
						equipped with pick & place and usually incorporated with 
						Form. Some singulation machines are incorporated with 
						laser marker and mark (also lead) scanner. Its pick & 
						place mechanism is capable of sorting detected defects.
						 
						 
						Let me know what is not clear.  
						 
						Best regards, Jefriz  | 
					 
				 
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						Posted by 
						Mike_Balbuena: Thu Jul 06, 2006 8:48 am   
						 Post subject: TSOP Singulation  | 
					 
					
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						Hi Jefriz,  
						
        
						
						
						 
						
      
        
        
        
        
        
        
        
        
        
        
        				
						I was referring to Jedec.  
						 
						So do you mean most of the equipment has a pick and 
						place and can load it in tray a lot easier. Does other 
						equipment has tape and reel as well? Is it inconvenient 
						to request from manufacturers that units be in tray or 
						tape and reel? 
						I'm trying to determine if most of the industries has 
						tape and reel incorporated in their system. If not I 
						will just have our supplier shipped to us on tray. 
						Does other companies still used the traditional way of 
						loading on tubes during singulation?  
						 
						Thanks, 
						Mike B.  | 
					 
				 
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						Posted by Jefriz: Fri 
						Jul 07, 2006 10:40 am    Post 
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						Hello Mike,  
						 
						For tray base singulation, all have pick & place while 
						tube base have the rail guide pusher (or similar 
						mechanism). The general concept is that manual 
						intervention is very limited. Your output is already in 
						tray or tube. Tape and reel can be done but I think you 
						would not select this since you still going to do 
						electrical testing. Selecting tray or tube would depend 
						on some factors, like what is your final test handler 
						set-up (tray or tube). And also cost of units on tray or 
						tube. If you are still going to buy a test handler or if 
						you are capable for both tray & tube, I think tube base 
						is more cheaper, more easier to handle and handler 
						mechanisms are very much simple although some package 
						related defects occur during the gravity feeding 
						movement of the units. If your TSOP have a thick body 
						size, tube is still suitable but for thinner body 
						(around 1 mm), tray base is much advisable. Convenience 
						to the manufacturer would depend on their capability. If 
						they can deliver on both tray and tube, you will just 
						consider your handler capability.  
						 
						Tape and reel (T&R) units packing are usually done when 
						the next step is already SMT since pick and place 
						machines much prefer it. Most companies are adding the 
						capability of T&R because of more customer demand. Let 
						us face it, cost is a big factor and T&R is one of the 
						most (or the most) cheapest IC packing.  
						 
						Some companies are still using tubes after singulation 
						because their test handler needs the units to be in 
						tubes.  
						 
						Regarding the JEDEC standard you mention, sorry if I 
						have not encountered such JEDEC standard that dictates 
						what specific packing method to use (can you give the 
						JESD/EIA number). In my opinion, JEDEC (industry) 
						Standard only recommends what to use. Which means that 
						most companies use these for several reasons like 
						convenience and cost effective but it would still depend 
						on each individual company’s capability and/or 
						direction. I don’t recommend that you generally stick 
						with the industry standards (like JEDEC) but only use 
						them as guide, if this suites your need then use it but 
						if it does not, then you might need to have an ”out of 
						the box” approach.  
						 
						Best Regards, Jefriz  | 
					 
				 
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						Posted by 
						Mike_Balbuena: Fri Jul 07, 2006 8:08 pm   
						 Post subject: Thanks  | 
					 
					
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						Hi Jefriz,  
						
        
						
						
						 
						
      
        
        
        
        
        
        
        
        
        
        
        				
						Thanks for the good answer....back in the days I used to 
						work in OSEP and I was one of the set-up engineers in 
						the Phil. You should be familiar with that company since 
						your in Taiwan.  
						 
						Thanks so much but I'll keep in touch.  
						 
						More power to EESemi!!!!  
						 
						Regards, 
						Mike B.  | 
					 
				 
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