Posted by Jasonroot: Sat Jan 27, 2007 9:41 am    Post subject: About MCM-C

Hello everybody
Who can tell me some process flow about MCM-ceramic?

Posted by FARel Engr: Tue Jan 30, 2007 12:20 am    Post subject:

Hi Jasonroot,

If I remember my hybrid manufacturing days correctly, it's basically the same as monolithic die ceramic packaging, except that several components are mounted on the substrate plus the extra challenge of having to deal with die-to-die wirebonding. After this, the rest of the process is basically the same.

FARel Engr

Posted by Jasonroot: Tue Jan 30, 2007 1:43 pm    Post subject:

Thanks,FARel Engr!
We have the process of die-to-die wirebonding,but the die attach process of the ceramic substrate is the challenge to me.I want to know how to pick ceramic substrate from waffle tray,because usually our process is picking the die from wafer tape.And on the ceramic substrate,there are some R/C components,I think perhaps it can't pick from blue tape or UV tape.Do you think so?

Posted by Sebastian: Fri Feb 02, 2007 4:51 pm    Post subject:

Hi,

Other pkgs/components aside from die are being picked using a PnP machine and or/ chip shooters.

R/C components are in feeders and bigger ones are in trays. You can's use tapes to store the ceramic substrates. Its either on big feeders or trays. Either way DA machine won't work. It has to be a Pnp machine.

regards...

Posted by Jasonroot: Sat Feb 03, 2007 9:52 am    Post subject:

Thanks,Sebastian!
Can you give me some equipment models about P&P or Chip shooters?I want to know some more about picking accidented ceramic substrate surface.

Posted by Sebastian: Mon Feb 05, 2007 3:12 pm    Post subject:

When I used to work for PCB assy, the best PnP machines then were Panasert and Dynapert.

The Panasert (the model then was MK2C, probably a lot better models available now) is configured for volume runners usually catering only R/C passive components and some small ICs (SOIC/TSSOP). It has more than 50 feeders of varying sizes and mounts these components to mother boards at faster rate. The limitation of this machine is flexibilty as bigger ICs like TQFPs can no longer be picked.

Dynapert on the other hand was more flexible handling virtually the whole range of pkgs from 10mils x 10mils resistors/MELFs to 200+ leads TQFPs, etc. Its drawback is UPH as the machine needs more precision due to fine pitch pkgs.

You need to check and weigh what machine you need based on your current product before even trying to buy-off machine and/or plan to raise PO, if at all.

The funny thing is (as experience tells me so) you may just settle for manual component attachment assigning some optrs to mount it prior reflow (or epoxy cure) if only a handful of these components are to mounted on the boards.

Saves you a lot of effort, time, etc and gives almost the same result.

regards...