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        EOS Vs. ESD Manual 
                       
        
        
        
        
        
                
        
        
              
		        
         
        
        
        
        
        
        
        
        
        
        
        
        
		Distinguishing between ESD and EOS failures has always been of interest 
		to failure analysts. Sometimes it is easy to do - gross metallization 
		burn-outs will always be attributed to EOS, while a point rupture at the 
		interface between an input thin-film resistor and a metal line is always 
		indicatve of ESD damage. But what if the attributes exhibited by the 
		device falls in between those of EOS and ESD?  
		
          
		 
        
        
        
        
        
        
        
        
        
        
        
        In the 
		archived forum thread below, the original poster is looking for an 
		off-the-shelf manual showcasing ESD vs. EOS  photos. Since ESD and 
		EOS failure attributes depend not only on the nature of the electrical 
		stress, but also on the circuit design, die lay-out, and fab process 
		used, it would be difficult (if not impossible) to come up with a 
		catch-all manual that will tell one how to distinguish between EOS and 
		ESD failures.  A more practical approach therefore is to generate 
		an in-house compilation of EOS/ESD photos instead involving your own 
		devices. This compilation must be generated by a highly-controlled 
		process for simulating the EOS/ESD failures. 
		
             
		
			
				
				
					
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						Posted by 
						Mike_balbuena: Thu Jan 11, 2007 6:18 am   
						 Post subject: EOS and ESD Manual  | 
					 
					
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						Do you have a reference manual 
						pictures and case files on the difference of EOS from 
						ESD failures?
						If you have, can you give me the manual’s name so we can 
						buy it.  
						 
						Thanks, 
						Mike B.  | 
					 
				 
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						Posted by Anti Static: 
						Sat Jan 27, 2007 4:55 pm   
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						Hi Mike,  
						 
						We've also tried looking for a manual on this issue 
						(determining the real root cause of device failure; ESD 
						or EOS) but up to now we cannot find a single source 
						manual that clearly explain this.  
						 
						During a previous ESD forum, one recommendation from the 
						speaker is to obtain samples of good units, zapped 
						intentionally, decap for analysis.  
						 
						The defect signature for every type of ESD event and for 
						every leads of the unit, and for different voltage 
						level, can be compiled as a baseline reference.  
						 
						Once an ESD failure is suspected, we can always use the 
						above compilation for our reference.  | 
					 
				 
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						Posted by FARel Engr: 
						Tue Jan 30, 2007 12:13 am   
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						Hi guys,  
						 
						I'd venture to say that a general, off-the-shelf manual 
						that distinguishes between ESD and EOS damage can not be 
						made, since the failure attributes they generate are 
						also affected by the circuit design, the device lay-out, 
						the fab process used, the assy/test/handling processes 
						employed, etc.  
						 
						However, you might be able generate such an ESD/EOS 
						look-up table on a per-product or per-product family 
						basis within your company, as Anti-Static has hinted, 
						which means that this will have to be internally 
						generated by your staff. Such information would be very 
						useful to include if you have an FA database.  
						 
						Good luck!  
						 
						FARel Engr  | 
					 
				 
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