LGA - Land Grid Array

  

The Land Grid Array, or LGA, is a package that uses metal pads for external electrical connection instead of leads (as in the pin grid array) or solder balls (as in the ball grid array).  These metal pads, which are called 'lands', are arranged in a grid or array at the bottom of the package body, hence the name 'land grid array'.  The grid arrangement of the lands of the LGA package allows it to have a high land count, making it a popular packaging option for devices with high I/O requirements.

   

Typical LGA's have land counts that range from 8 to 1681. LGA's with the lowest land counts are basically QFN's, since the lands of these packages just occupy the periphery of the body. Land pitch (distance between lands) values typically used by the LGA range from 1.0 mm to 1.27 mm. 
      

Table 1. Properties of Some LGA's

No. of Lands

Body Size

Body Thickness

Land Pitch

10

5 mm x 3 mm

1.49 mm

1.27 mm

21

6.25 mm x 6.25 mm

2.32 mm

1.27 mm

35

11.25 mm x 6.25 mm

2.82 mm

1.27 mm

56

11.25 mm x 9 mm

2.82 mm

1.27 mm

84

15 mm x 9 mm

4.32 mm

1.27 mm

104

15 mm x 15 mm

2.82 mm

1.27 mm

144

15 mm x 15 mm

4.32 mm

1.27 mm

204

22 mm x 15 mm

4.32 mm

1.27 mm

   

Figure 1.  Example of a Land Grid Array (LGA)

      

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