PBGA - Plastic Ball Grid Array                              

                

The Plastic Ball Grid Array, or PBGA, is a square-shaped plastic-molded package that uses solder balls for external electrical connection instead of leads.  These solder balls are arranged in a grid or array at the bottom of the plastic package body, hence the name 'plastic ball grid array'.  Actually, the PBGA is just one of several types of the BGA package.

   

Typical PBGA's have ball counts that range from 68 to 356, although PBGA's with more balls do exist. Ball pitch (distance between solder balls) values typically used by the PBGA include: 1.0 mm, 1.27 mm, and 1.5 mm.  Solder ball arrangement patterns used by the PBGA can be one of these three:  perimeter, staggered, or full grid array.  PBGA body sizes can range from 13 mm square to 45 mm square.
      

Table 1. Properties of Some PBGA's

No. of Balls

Body Size

Ball Matrix

Ball Pitch

144

13 mm x 13 mm

12 x 12 - full grid

1.0 mm

160

15 mm x 15 mm

14 x 14 - perimeter

1.0 mm

196

15 mm x 15 mm

14 x 14 - full grid

1.0 mm

256

17 mm x 17 mm

16 x 16 - full grid

1.0 mm

288

23 mm x 23 mm

22 x 22 - perimeter

1.0 mm

324

23 mm x 23 mm

22 x 22 - perimeter

1.0 mm

   

Figure 1.  Example of a PBGA from Amkor

      

See also:  Ball Grid Array (BGA)

See more IC Package Types

   

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