The
Plastic Ball
Grid Array,
or PBGA,
is
a square-shaped plastic-molded package that uses solder balls for
external electrical connection instead of leads. These solder
balls are arranged in a grid or
array at the bottom of the plastic package body, hence the name 'plastic
ball grid array'.
Actually,
the PBGA is just
one of several types of the BGA package.
Typical PBGA's have
ball counts that range from 68 to 356, although PBGA's with more balls do
exist. Ball pitch
(distance between
solder balls) values typically used by the PBGA include: 1.0 mm, 1.27
mm, and 1.5 mm. Solder ball arrangement patterns used by the PBGA
can be one of these three: perimeter, staggered, or full grid
array. PBGA body sizes can range from 13 mm square to 45 mm square.
Table 1.
Properties of Some PBGA's
|
No. of
Balls |
Body
Size |
Ball Matrix |
Ball Pitch |
|
144 |
13 mm x 13
mm |
12 x 12 -
full grid |
1.0 mm |
|
160 |
15 mm x
15 mm |
14 x 14 -
perimeter |
1.0 mm |
|
196 |
15 mm x
15 mm |
14 x 14 -
full grid |
1.0 mm |
|
256 |
17 mm x
17 mm |
16 x 16 -
full grid |
1.0 mm |
|
288 |
23 mm x
23 mm |
22 x 22 -
perimeter |
1.0 mm |
|
324 |
23 mm x
23 mm |
22 x 22 -
perimeter |
1.0 mm |
