PQFN - Power Quad Flat No Leads

                

The Power Quad Flat No Leads package, or PQFN, is a small square-shaped or rectangular surface-mount plastic package with no leads that is capable of high power dissipation.  Instead of leads, it uses metal pads around the periphery of the bottom of the package body for electrical connection to the outside world.  It is basically a 'high-power' version of the quad flat no leads (QFN) package.

   

The capability of the PQFN to handle the heat emitted by high-power devices comes from one or more exposed heat sinks at the package bottom, as well as its use of thick copper lead frames, solder die attach material, and heavy-gauge bonding wires. The heat sinks, which are physically connected to the die pad,  efficiently transfer the excess heat from the die to the PCB.

   

Typical PQFN pad counts range from 8 to 42. The maximum package height values of different PQFN packages vary widely, ranging from 0.9 mm to over 2 mm. The body sizes of typical PQFN's range from 5 mm. square to 12 mm. square.  The pad pitch (distance between pads) used by PQFN packages is usually one of the following: 0.50 mm, 0.65 mm, 0.80 mm, and 0.90 mm.

   

Table 1. Properties of Some Examples of PQFN's

No. of Pads

Body Size

Package Height

Pad Pitch

8

3.3 mm x 3.3 mm

1.1 mm

0.65 mm

16

4 mm x 4 mm

0.9 mm

0.65 mm

20

5 mm x 6 mm

0.9 mm

0.80 mm

24

12 mm x 12 mm

2.2 mm

0.90 mm

28

5 mm x 5 mm

0.9 mm

0.50 mm

32

4 mm x 6 mm

0.9 mm

0.50 mm

32

8 mm x 8 mm

2.2 mm

0.80 mm

   

Figure 1.  Bottom and top views of an example of a PQFN package

   

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