PSOP - Power Small Outline Package

                

The Power Small Outline Package, or PSOP, is a rectangular small outline IC package developed by Amkor that integrates a copper heat slug in its plastic body. The die is attached to this heat slug, increasing the chip's ability to dissipate heat and thus handle more power.  The PSOP achieves 40% theta JA improvement over that of standard SOIC's.

     

The PSOP is offered with a low stand-off of 2 mils (0.002 inch).  The leads of the PSOP is mechanically connected to but electrically isolated from the heat slug. Amkor offers two types of PSOP: PSOP-2 and PSOP-3.  The PSOP-2 has a standard exposed heat slug while the PSOP-3 has an enlarged exposed heat slug that protrudes out of the package bottom, allowing the slug to be thermally connected to the PCB for greater heat dissipation capability.

   

Table 1. Properties of some PSOP's of Amkor

Package Type

No.
of Pins

Body Width

Body Length

Body Thickness

Lead
Pitch

Units/ Tube

PSOP-2

8

3.8 mm

4.93 mm

1.52 mm

1.27 mm

97

PSOP-2

16

3.8 mm

9.93 mm

1.52 mm

1.27 mm

48

PSOP-2

16

7.6 mm

10.33 mm

2.34 mm

1.27 mm

46

PSOP-2

20

7.6 mm

12.83 mm

2.34 mm

1.27 mm

37

PSOP-2

24

7.6 mm

15.42 mm

2.34 mm

1.27 mm

31

PSOP-2

28

7.6 mm

17.93 mm

2.34 mm

1.27 mm

27

PSOP-3

20

11 mm

15.90 mm

3.15 mm

1.27 mm

31

PSOP-3

24

11 mm

15.90 mm

3.15 mm

1.00 mm

27

PSOP-3

30

11 mm

15.90 mm

3.15 mm

0.80 mm

27

PSOP-3

36

11 mm

15.90 mm

3.15 mm

0.65 mm

27

   

Figure 1.  Examples of PSOP IC's from Amkor

source: www.amkor.com

   

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