SSOP - Shrink Small Outline Package

             

The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a  compressed body and a tightened lead pitch.

  

SSOP lead counts range from 8 to 64. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1.65 mm to 1.85 mm. The SSOP package is JEDEC- and EIAJ- compliant. SSOP's have solder-plated gull-wing leads that are protruding from the longer sides of the package.

   

Table 1. Properties of Some Examples of SSOP's

Part Number

No.
of Pins

Body
Width

Pitch

Qty
Per Tube

Tape
Width

Tape
Pitch

Qty
13" Reel

SSOP8

8

5.3mm

.65mm

156

12mm

8mm

2,500

SSOP14/16

14/16

5.3mm

.65mm

100/80

16mm

12mm

1,000

SSOP20/24

20/24

5.3mm

.65mm

66/62

16mm

12mm

1,000

SSOP28

28

5.3mm

.65mm

47

16mm

12mm

1,000

SSOP48

48

7.6mm

1.27mm

30

32mm

12/16mm

1,000

SSOP56

56

7.6mm

1.27mm

26

32mm

12/16mm

500

SSOP64

64

10.2mm

.8mm

44mm

16/24mm

500

 

   

Figure 1.  Examples of SSOP packages (not in scale with each other)

   

See more IC Package Types

   

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