UTDFN - Ultra Thin Dual Flat No Leads

                                                  

The Ultra Thin Dual Flat No Leads package, or UTDFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads. Instead of leads, it uses metal pads along two sides of the package body for electrical connection to the outside world.  It is basically a thinner version of the thin dual flat no leads (TDFN) package.

   

Typical UTDFN pad counts range from 6 to 14. The body thickness of UTDFN packages typically ranges from 0.40 mm to 0.55 mm. The pad pitch (distance between pads) used by UTDFN packages is usually either 0.4 mm or 0.5 mm. 

      

Table 1. Properties of Some Examples of UTDFN's

No. of Pads

Body Size

Body Thickness

Pad Pitch

6

1 mm x 1.2 mm

0.50 mm

0.4 mm

6

3 mm x 3 mm

0.55 mm

0.5 mm

8

2 mm x 2 mm

0.55 mm

0.45 mm

10

3 mm x 3 mm

0.55 mm

0.5 mm

14

3 mm x 4 mm

0.55 mm

0.5 mm

   

Figure 1.  Top and bottom views of a UTDFN package

   

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