UTQFN - Ultra Thin Quad Flat No Leads

                                                  

The Ultra Thin Quad Flat No Leads package, or UTQFN, is a very small and thin square-shaped or rectangular surface-mount plastic package with no leads.  Instead of leads, it uses metal pads around the periphery of the package body for electrical connection to the outside world.  It is basically a thinner version of the thin quad flat no leads (TQFN) package.

  

Typical UTQFN pad counts range from 6 to 28. The body thickness of UTQFN packages typically ranges from 0.50 mm to 0.60 mm. The pad pitch (distance between pads) used by UTQFN packages is usually either 0.4 mm or 0.5 mm. 

   

Table 1. Properties of Some Examples of UTQFN's

No. of Pads

Body Size

Body Thickness

Pad Pitch

10

1.4 mm x 1.8 mm

0.5 mm

0.4 mm

10

1.6 mm x 2.1 mm

0.5 mm

0.5 mm

16

3 mm x 3 mm

0.55 mm

0.5 mm

20

3 mm x 4 mm

0.55 mm

0.5 mm

24

4 mm x 4 mm

0.55 mm

0.5 mm

28

4 mm x 4 mm

0.55 mm

0.4 mm

   

Figure 1.  Top and bottom views of a UTQFN package

   

See more IC Package Types

  

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