CCGA - Ceramic Column Grid Array

         

The Ceramic Column Grid Array, or CCGA, is a square-shaped or rectangular ceramic package that uses solder columns for external electrical connection instead of leads or solder balls.  These solder columns are arranged in a grid or array at the bottom of the ceramic package body, hence the name 'ceramic column grid array'.  The CCGA is basically just a CBGA package that has solder columns instead of solder balls.

   

The main advantage of CCGA over CBGA is the higher reliability of the solder columns compared to solder balls.  The columns provide a higher package stand-off and structural flexibility, allowing the CCGA to adapt to CTE mismatches with the PCB more easily than CBGA's.

    

The CCGA package is designed for high I/O applications, with column counts typically ranging from 191 to 2577. Column pitch (distance between solder columns) values typically used by the CCGA package are 1.0 mm and 1.27 mm.  Typical CCGA body sizes range from 14 mm square to 52.5 mm square. The height of the solder column from the ceramic body of the CCGA is typically either 1.27 mm or 2.2 mm. 

   

Table 1. Properties of Some CCGA's

No. of Columns

Body Size

Package

Thickness

Column Pitch

376

27.94 mm x 27.94 mm

2.79 mm

1.27 mm

376

27.94 mm x 27.94 mm

2.79 mm

1.27 mm

624

32.5 mm x 32.5 mm

2.5 mm

1.27 mm

1152

35 mm x 35 mm

3 mm

1.0 mm

1272

37.5 mm x 37.5 mm

3 mm

1.0 mm

   

Figure 1.  Example of a CCGA

Figure 2.  Solder columns of a CCGA

   

See also:  Ball Grid Array (BGA); CBGA

See more IC Package Types

 

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