TFBGA - Thin Profile Fine-Pitch Ball Grid Array

                

The Thin Profile Fine Pitch Ball Grid Array, or TFBGA, is a thinner version of the FBGA package. Like all BGA packages, TFBGA's use solder balls that are arranged in a grid or array at the bottom of the package body for external electrical connection.  The TFBGA is near-chip-scale in size and features ball pitch values that are even tighter than those of the FBGA.

    

Typical TFBGA's have ball counts that range from 16 to 384 solder balls. The typical TFBGA ball pitch is 0.5 mm to 0.8 mm. The typical TFBGA package thickness is greater than 1 mm but not more than 1.2 mm.

   

Table 1. Properties of Some TFBGA's

No. of Balls

Body Size

Package Height

(incl. solder balls)

Ball Pitch

16

3 mm x 3 mm

1.2 mm

0.5 mm

48

7 mm x 7 mm

1.2 mm

0.75 mm

64

7 mm x 7 mm

1.1 mm

0.5 mm

72

5 mm x 5 mm

1.2 mm

0.5 mm

121

6 mm x 6 mm

1.2 mm

0.5 mm

152

14 mm x 14 mm

1.1 mm

0.65 mm

196

8 mm x 8 mm

1.2 mm

0.5 mm

324

15 mm x 15 mm

1.2 mm

0.8 mm

 

   

Figure 1.  Top and bottom views of an example of a Thin Fine-Pitch Ball Grid Array (TFBGA)

   

See also:  Ball Grid Array (BGA)FBGA;

See more IC Package Types

   

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