XQFN - Extremely Thin Quad Flat No Leads

                                                  

The Extremely Thin Quad Flat No Leads package, or XQFN, is a very small and extremely thin square-shaped or rectangular surface-mount plastic package with no leads.  Instead of leads, it uses metal pads around the periphery of the package body for electrical connection to the outside world.  It is basically a thinner version of the ultra thin quad flat no leads (UTQFN) package.

  

The body thickness of XQFN packages typically has a maximum value of 0.40 mm. The pad pitch (distance between pads) used by XQFN packages varies from 0.35 mm to 0.5 mm.

   

Table 1. Properties of Some Examples of XQFN's

No. of Pads

Body Size

Body Thickness

Pad Pitch

12

2.5 mm x 2.5 mm

0.4 mm

0.5 mm

14

2.5 mm x 2.5 mm

0.35 mm

0.5 mm

20

2.7 mm x 2.7 mm

0.35 mm

0.4 mm

22

2.4 mm x 3.3 mm

0.35 mm

0.4 mm

24

2.2 mm x 2.9 mm

0.35 mm

0.35 mm

36

5 mm x 5 mm

0.45 mm

0.4 mm

   

Figure 1.  Top and bottom views of an XQFN package

   

See more IC Package Types

  

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