LFBGA - Low Profile Fine-Pitch Ball Grid Array

         

The Low-Profile Fine Pitch Ball Grid Array, or LFPBGA, is a smaller version of the ball grid array (BGA) package. It is basically an FBGA package that has a package height ranging from 1.2 mm and 1.7 mm.  It is therefore thicker than the TFBGA and the VFBGA.

    

Typical LFBGA's have ball counts that range from 48 to 865 solder balls. The typical LFBGA ball pitch is 0.50 mm to 0.8 mm. A typical LFBGA is about 1.3 mm to 1.7 mm thick.

   

Table 1. Properties of Some LFBGA's

No. of Balls

Body Size

Package Height

(incl. solder balls)

Ball Pitch

96

5.5 mm x 13.5 mm

1.4 mm

0.8 mm

100

10 mm x 10 mm

1.6 mm

0.8 mm

144

10 mm x 10 mm

1.4 mm

0.8 mm

225

13 mm x 13 mm

1.5 mm

0.8 mm

240

13 mm x 13 mm

1.7 mm

0.65 mm

289

15 mm x 15 mm

1.4 mm

0.8 mm

357

20 mm x 20 mm

1.5 mm

0.8 mm

529

14 mm x 14 mm

1.35 mm

0.5 mm

865

17 mm x 17 mm

1.4 mm

0.5 mm

   

Figure 1.  Top and bottom views of an example of a Low Profile Fine-Pitch Ball Grid Array (LFBGA)

   

See also:  Ball Grid Array (BGA)FBGA

See more IC Package Types

 

HOME

                       

Copyright 2008 www.EESemi.com. All Rights Reserved.